JPH0524676B2 - - Google Patents
Info
- Publication number
- JPH0524676B2 JPH0524676B2 JP34339289A JP34339289A JPH0524676B2 JP H0524676 B2 JPH0524676 B2 JP H0524676B2 JP 34339289 A JP34339289 A JP 34339289A JP 34339289 A JP34339289 A JP 34339289A JP H0524676 B2 JPH0524676 B2 JP H0524676B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- flexible printed
- circuit board
- pressure
- sensitive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 25
- 239000010410 layer Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34339289A JPH03204989A (ja) | 1989-12-31 | 1989-12-31 | フレキシブルプリント回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34339289A JPH03204989A (ja) | 1989-12-31 | 1989-12-31 | フレキシブルプリント回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03204989A JPH03204989A (ja) | 1991-09-06 |
| JPH0524676B2 true JPH0524676B2 (en]) | 1993-04-08 |
Family
ID=18361160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34339289A Granted JPH03204989A (ja) | 1989-12-31 | 1989-12-31 | フレキシブルプリント回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03204989A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009277804A (ja) * | 2008-05-13 | 2009-11-26 | Ricoh Co Ltd | パターン配列シート、その製造方法、電子デバイスチップ及びその製造方法 |
| CN109936920A (zh) * | 2017-12-16 | 2019-06-25 | 神讯电脑(昆山)有限公司 | Led灯条的连板结构 |
-
1989
- 1989-12-31 JP JP34339289A patent/JPH03204989A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03204989A (ja) | 1991-09-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |